Specialists in photonic integrated circuit (PIC) packaging for proof of concept, prototyping and production, using compound semiconductor and laser/LED assembly, including hermetic fiber/fiber array and/or micro-optics, development and design for manufacture (DFM). Offers both design consultancy and assembly/packaging services.
Established: 2007
Employees: 31
Facility area (sq ft): 10,000
Ownership type: Privately Owned