Surface processing solutions for technology industries such as semiconductor, MEMS, automotive, defense and aerospace, life sciences, and IoT: CMP, polishing, substrate thinning, substrate cleaning, as well as substrate and wafer bonding. Products include process development and foundry services, process tools, and post-installation service and support.
Established: 2002
Employees: 85
Facility area (sq ft): 85,000
Ownership type: Privately Owned