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Zaber Technologies - Plug and Play LB 12/25
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Fineplacer Lambda 2 Die Bonder

About FINETECH GmbH & Co. KG

  • Type: Equipment
  • Placement accuracy: submicron
  • Guidance: software supported

This table top flip chip bonder can be easily configured for a wide range of applications for process development or prototyping.

Fineplacer Lambda 2 Die Bonder

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