Photonics ProductsCoatings & MaterialsCoating Equip. & AccessoriesSputtering Targets
Backing Plates
About Process Materials Inc.- Type: Sputtering Targets
- Applications: Biomedical/Medical, Communications, Industrial, Other
- Shapes: Variable Sizes, Shapes and Geometries
- Materials Used: Oxygen-free, High Conductivity (OFHC) Copper, Molybdenum, Titanium, Aluminum (Alloys) and Stainless Steel
Backing plates are used to mount the target in the sputtering system, so their selection is critical. Process Materials manufactures standard and custom designs to suit your specific sputtering process.
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