About FINETECH
Submicron die bonders for photonics packaging, assembly, and die attach. Bonding of laser bars and diodes, VCSELs, silicon photonics, sensors, flip chip, LEDs, transceivers, and lidar devices. Systems provide high-process flexibility in one platform; manual, motorized, and automated models for a variety of bonding applications.
Established: 1992
Ownership type: Privately Owned
Executives:
Ray Burghard, Managing Director
Steve Breed, Director of Sales