iPronics Collaborates with Ansys to Boost PIC Reliability
iPronics, a developer of software-defined photonics, is collaborating with software solution provider Ansys to accelerate the development of next-generation photonic integrated circuits (PICs). The collaboration will merge iPronics’s design of fabrication-tolerant photonic component with Ansys’ multiphysics simulation tools to advance high-performance optical technologies for AI and cloud data centers.
Simulation of a silicon photonic building block. Courtesy of iPronics.
iPronics will integrate Ansys solutions across its core development workflow — from optical layout to packaging and thermal simulations — enabling full-stack design and validation of PICs that perform reliably despite fabrication variability, according to the company. The components are foundational for energy-efficient, low-latency future data center interconnects essential to AI workloads.
“As data center outages increasingly impact end applications, technologies like optical circuit switching are emerging as essential to next-generation AI infrastructure,” said Daniel Pérez López, co-founder and CTO of iPronics. The company’s work with Ansys, he said, accelerates development cycles while enhancing system reliability, allowing high circuit density optical engines optimized for AI workloads — from optical cores to electronics and thermal packaging.
Targeting high-reliability and scalable communication for energy-efficient AI, iPronics raised more than $20M in funding earlier this year, to help accelerate deployment of its company’s Optical Networking Engine (ONE) in AI data centers. iPronics’ ONE technology enables "at-will" topology adaptation and extending programmability to physical layer connections. According to the company it provides 1000× faster reconfiguration compared to other optic based approaches, lossless operation, lower cost-per-port, and higher reliability due to its solid-state chip design.
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