Halo Industries, a developer of laser manufacturing technology for the semiconductor industry, has raised up to $80 million in a Series B funding round. The company plans to use the funds to scale the commercialization and reach of its technology targeted for silicon carbide (SiC) substrate production. Halo Industries’ proprietary laser-based tools and processing technologies are designed to enable efficient, precise, and high-quality manufacturing that minimizes the cost, waste, and environmental impact associated with traditional manufacturing methods. According to Halo, its manufacturing innovations significantly increase SiC wafer yield and quality, providing growth opportunities for downstream applications including electric vehicles (EVs); EV charging stations; solar/wind power electronics; electric grid infrastructure; industrial motor drives; heating, ventilation, and air conditioning; electric rail/transit; and aerospace and defense. Further, the company’s technologies have been demonstrated to work on various advanced materials such as silicon, diamond, sapphire, lithium tantalate, gallium nitride, and others.
