Photonics HandbookBusiness
Hexagon, Sony Semiconductor Solutions Partner on Reality Capture
STOCKHOLM, June 20, 2023 — Digital reality solutions provider Hexagon AB partnered with image sensor developer Sony Semiconductor Solutions Corp. Hexagon aims to advance its reality capture solutions by integrating Sony’s time-of-flight (ToF) image sensor and software to enhance speed and accuracy.
Hexagon will integrate Sony’s capabilities into the development of the new Leica BLK2GO PULSE product, which the company plans to release in 2024. The hand-held reality capture device fuses ToF technology from Sony and Hexagon’s GrandSLAM technology — which itself combines lidar and visual simultaneous localization and mapping with an inertial measurement unit — to create a first-person scanning method to capture only the needed target from the user’s point of view. The BLK2GO PULSE will be primarily used for short-range indoor applications with instant point cloud visualization during capture.
/Buyers_Guide/Hexagon_AB/c33262
/Buyers_Guide/Leica_Geosystems_AG/c30772
/Buyers_Guide/Sony_Semiconductor_Solutions_Corp/c32054