SAXONBURG, Pa., March 28, 2025 — Coherent Corp. intends to sell its epitaxial fabrication facility in Champaign, Ill., as part of its ongoing initiatives to optimize its manufacturing footprint. The 65,000 sq ft campus features five G3 epi systems in 15,000 sq ft of Class 1000 ballroom-style cleanrooms. The fab is facilitized for up to 10 epitaxial tools and previously produced 2 in to 6 in indium phosphide and gallium arsenide wafers. The site comprises four buildings and a variety of fabrication and characterization equipment.
Industry leaders, policy makers, and academics meet at CORNERSTONE’s photonics roundtable event. Courtesy of the CORNERSTONE Photonics Innovation Centre.
SOUTHAMPTON, England — The CORNERSTONE Photonics Innovation Centre, a silicon photonics prototyping foundry affiliated with the University of Southampton and the University of Glasgow, has wrapped up its “Roundtable: Light for Future Semiconductors – Unlocking Economic Growth Through Photonics” event held March 18. The roundtable event brought together policymakers, industry leaders, and academic experts to explore the role of photonics in driving next-generation technologies. The discussion underscored photonics as an enabler of innovation and economic growth, with a focus on fostering collaboration between research clusters in order to avoid competition and silos. CORNERSTONE is working to develop policy recommendations and further actions in an effort to ensure the U.K. remains a part of photonics-driven innovation.
KISTA, Sweden — Photonics and wireless technologies company Sivers Semiconductors has entered into a partnership with semiconductor manufacturer WIN Semiconductor to enhance production of Sivers’ DFB lasers and laser arrays technology. WIN will serve as an outsourced manufacturing partner for Sivers, enabling the company to scale production.
TORONTO — Xanadu, a photonic quantum computing company, and Corning Inc. have entered into a collaboration to develop customized fiber and fiber-array solutions to enable low-loss networking of photonic quantum computing chips. This collaboration will bring together Xanadu’s expertise in developing ultra low-loss photonic chip components using customized fabrication and design techniques, and Corning’s innovations in low-loss optical fiber and high-precision fiber arrays.
Ansys and Global Foundries have certified four Ansys photonic solvers in the GF Fotonix platform. Courtesy of Ansys.
PITTSBURGH — Software developer Ansys has entered into a collaboration with GlobalFoundries to certify four Ansys photonic solvers for simulating passive and active photonic components with high-fidelity within the GF Fotonix platform. The certifications span a range of capabilities, from passive to active photonic component design, including modeling the effects of electrical and thermal stimulus on optical behavior.
HERZOGENRATH, Germany — AIXTRON SE, a semiconductor deposition equipment provider, has become a partner in the Graphene as a functional layer in UVC LEDs (GraFunkL) project, a research project for the use of novel UVC LEDs against multi-resistant hospital pathogens as well as in applying graphene over wafers up to 150 mm in diameter. AIXTRON will partner with the University of Duisburg-Essen’s Materials for Electrical Engineering department, THz measurement company Protemics GmbH, and ams OSRAM, and will be funded by Germany’s Federal Ministry of Education and Research with €2.1 million ($2.3 million) over the next three years.
TUCSON, Ariz. — Optical technologies and pulsed laser systems company Applied Energetics has moved to the next phase in its strategic collaboration with integrated aerospace and defense company Kord Technologies to explore the potential development and integration of an advanced pulsed laser system with Kord's FIREFLY high energy laser weapon system. The development and integration efforts are planned to take place at Applied Energetics’ newly established Battle Lab in Tucson, Ariz., a facility designed to facilitate the advancement of innovative laser technologies. If successful, the integration of Applied Energetics’ pulsed laser technology with FIREFLY’s existing architecture could result in a layered, multifunctional system designed to counter a range of emerging threats.
Inova Semiconductors’ new headquarters in Munich. Courtesy of Inova Semiconductors.
MUNICH — Inova Semiconductors, a fabless semiconductor manufacturer, has moved to its new headquarters in Munich. The new location offers more than double the office space, providing the basis for the company’s planned international growth and continued development of innovative technologies. The move is part of a five-year growth strategy aimed at strong expansion, particularly in Asia and North America, said the company. Inova plans to increase its workforce to around 100 full-time positions in the next few years.
SAN FRANCISCO — The LPO MSA Group has completed and made available the 100 Gb/s per lane Linear Pluggable Optics Single-Mode Optical Data Transmission specification, targeting up to 800 Gigabit ethernet connectivity. Building upon other industry standards such as IEEE 802.3 and OIF, the LPO MSA specification includes component, module, and system-level interoperability requirements that span both the electrical and optical interfaces operating at 100 Gb/s per lane.
BANGALORE, India — Provider of system-in-package solutions for semiconductor and photonic applications izmo Microsystems has become an exclusive industry partner with IIT Madras in a project at the university’s Centre for Programmable Photonic Integrated Circuits and Systems, Center of Excellence. The partnership will focus on the design, development, and advanced packaging of programmable photonic processor cores using silicon photonics technology. The immediate aim of the center is to provide better solutions for microwave and quantum photonics applications.
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