Modular CCDs: Building Blocks for Large-Area Sensors

Albert Theuwissen, Philips Research

Using the concept of a jigsaw puzzle, the latest generation of high-resolution imagers is built up from several pieces of 1-megapixel blocks. Philips joins the pieces together using dedicated stitching patterns available on the masks during the lithographic process. The technology allows the user to pick a size that meets individual requirements up to 7k x 9k pixels -- a limit set by the size of the wafer substrate.