Unitive Completes $44 Million in Financing

RESEARCH TRIANGLE PARK, N.C., March 27 – Unitive Inc., a provider of outsourced advanced semiconductor packaging technologies, announced that it received $30 million in equity financing led by Onex Corp. Strategic investors participating in the round included Celestica Inc., Conexant Systems Inc., Fairchild Semiconductor International Inc. and Flextronics International LTD. Unitive also secured $14 million of debt financing for the purchase of capital equipment.
"We believe that demand for Unitive's products – which enable semiconductors to be smaller, faster and cheaper – will be explosive," said John Troiano, managing director of Onex's New York office.