Enosemi and Jabil Partner on Packaging for Photonic Chips

Silicon photonics startup Enosemi has entered into a collaboration with Jabil, which will provide Enosemi with packaging services to support higher bandwidth interconnects within AI compute systems. The partnership leverages Jabil’s expertise in silicon photonics, in particular its Advanced Photonics Packaging NPI center in Ottawa, Ontario.

Per the collaboration, Enosemi's chiplet and intellectual property (IP) customers will be able to leverage Jabil's expertise to develop highly integrated packages with AI application-specific integrated circuits and photonic chips.

Enosemi, which emerged from stealth in 2023, has existing 1.6 terabit/s photonic chiplets and design IP. The company uses a 300-mm wafer manufacturing process, and last year made available a portfolio of high-speed IP in the GlobalFoundries Fotonix IP platform.