Hyperlume Lands $12.5M Seed Round

Hyperlume has raised $12.5 million to support the commercialization of its high bandwidth, low latency, low power interconnects for data centers and high-performance computing systems. Founded in 2022, the company’s technology uses specialized, ultra-fast micro-LEDs and ultra-low power circuitry to achieve significant performance, cost, and energy-efficiency gains relative to the traditional copper interconnects.

Hyperlume plans to use the funds to accelerate development; expand its product, engineering, and R&D teams; and strengthen strategic partnerships with hyperscalers, chip manufacturers, and AI infrastructure providers as it prepares steps for production of its optical technology to meet demands for 800G and 1.6T interconnects.

The round, led by BDC's Deep Tech Venture Fund and ArcTern Ventures with participation from MUUS Climate Partners, SOSV, and Intel Capital, also includes a strategic investment from LG Technology Ventures.