IBM And Multilink Technology Join Forces On High-Speed Networks

EAST FISHKILL, N.Y., June 9 -- IBM and Multilink Technology Corp. (Multilink) will develop high-speed components for data and telecommunications applications. The companies will combine Multilink's ability to design communications components with IBM's advanced silicon germanium (SiGe) and CMOS technologies. Their goal will be the design of high speed 'transport layer' 10- and 40-Gb SONET, Synchronous Digital Hierarchy and Ethernet networks.
The continued growth of e-business depends upon advancements in semiconductor technologies, like IBM's SiGe, to enable high-speed network connectivity, said Christine King, vice president of Networking Technology for IBM. By working with Multilink, we intend to complement our custom logic, network processor and embedded PowerPC products with new high performance communications chips that will dramatically improve our customers' time-to-market.