Teledyne DALSA, ASML to Collaborate on Semiconductor Manufacture

High technology developer Teledyne DALSA Inc., in partnership with photolithography systems supplier ASML Holding NV, will produce pellicle membranes for use in extreme ultraviolet (EUV) lithography-based semiconductor fabrication.

ASML has designed the EUV lithography platform as an extendable platform that will enable the continued progress in microchip manufacturing, delivering chip-device cost reductions, power savings, and performance improvements well into the next decade.

Pellicles are extremely thin transparent membranes that allow transmission of UV photons, which protects photomasks from particles and contaminants during the semiconductor fabrication process. Pellicles, which are more than 1000× thinner than a human hair, must also be rugged enough to withstand very high temperatures during semiconductor processing. Pellicles are consumables that may be replaced a number of times during the life of a photomask, also known as a reticle.

“For nearly three years, Teledyne has worked in close collaboration with ASML on the development of this extremely challenging technology,” said Robert Mehrabian, chairman, president, and CEO of Teledyne. “Having manufactured microelectro mechanical systems, or MEMS, for over 20 years and with state-of-the art 200-mm processing tools, Teledyne has amassed extensive intellectual property and experience in the production of extremely thin films with precise control of mechanical, optical, and electrical properties.”

Teledyne DALSA is a developer of sensing, imaging, and specialized semiconductor fabrication technologies.