Wafer Bonding Agreement

3M of St. Paul, Minn., an advanced materials supplier for the semiconductor industry, and Tazmo Co. Ltd. of Okayama, Japan, an LCD manufacturing equipment and semiconductor supplier, have announced an agreement allowing the latter company to manufacture and sell equipment for temporary bonding of ultrathin wafers required for 3-D packaging. Under terms of the agreement, Tazmo will become a supplier for equipment configured to use 3M’s wafer support system materials, including the Liquid UV-Curable adhesive and the Light-to-Heat conversion coating. Both companies also will work together to address customer demands for high-performance process solutions.