NanoTech Alliance Tackles EUVL Challenges

Sematech, a global consortium of semiconductor manufacturers, and ASML, provider of lithography systems for the chip industry based in The Netherlands, announced they have joined forces at the College of Nanoscale Science and Engineering’s (CNSE) Albany NanoTech Complex.

As a member of the Lithography program, ASML will team with researchers at Sematech to advance EUV (extreme ultraviolet) lithography technology and its associate infrastructure components, including mask defect reduction, mask metrology infrastructure, source development, resist and materials development, and overall manufacturability and extendibility.

EUV is a new lithographic method using a source wavelength 15 times shorter than current lithography systems, enabling semiconductor scaling to resolutions of 10 nanometers (nm) and smaller. EUV, the leading candidate for manufacturing advanced semiconductors at the 22nm technology generation and beyond, will support Moore’s Law – the trend towards more powerful, energy-efficient yet affordable chips – for at least another 10 years.

“This partnership combines ASML’s vast array of technical expertise and recognized leadership in the industry with Sematech’s experience in building infrastructure for next-generation lithography technologies,” said John Warlaumont, Sematech’s vice president of advanced technology. “We share a commitment to keep EUVL on track for cost-effective high volume manufacturing, and will work together to continue the progress being made in EUV technology development to enable pilot and production lines.”

“As a single exposure solution and extendible technology, EUV provides the most cost-effective lithography for volume production of sub-3xnm devices,” said Ron Kool, vice president of EUV Lithography Systems at ASML. “Our collaboration with Sematech and CNSE demonstrates the industry’s commitment to EUV technology and the infrastructure necessary to extend semiconductor shrink for another decade or more.”

“The leading-edge research and development that is critical for the commercialization of EUVL technology will be further enhanced by this broader engagement with ASML,” said Richard Brilla, CNSE vice president for Strategy, Alliances and Consortia. “This partnership further leverages the Sematech -CNSE collaboration and builds on the world-class capabilities at the UAlbany NanoCollege in support of the advanced technology needs of our global corporate partners and the nanoelectronics industry.”

Sematech, ASML and CNSE have long collaborated in advanced lithography technology at the UAlbany NanoCollege, currently working together in such areas as EUV reticle carrier standards and developing ASML’s alpha scanner at CNSE. In addition to EUVL challenges, Sematech Lithography also focuses on extending 193nm immersion lithography, investigating alternative lithography technologies, and developing advanced resists for both immersion and EUV through the Resist and Materials Development Center at CNSE. Sematech members represent more than half the world’s semiconductor production.

For more information, visit: www.cnse.albany.edu