3M, EV Settle Patent Suit

3M of St. Paul, Minn., and EV Group of St. Florian, Austria, have agreed to settle patent infringement litigation relating to systems for temporary wafer bonding, brought by EVG against 3M in the US District Court for the Southern District of New York. Under the terms of the mostly confidential settlement, 3M, its customers, and licensed suppliers of its wafer support system will continue to make and sell the system in global semiconductor and packaging markets.





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