3M, EV Settle Patent Suit

3M of St. Paul, Minn., and EV Group of St. Florian, Austria, have agreed to settle patent infringement litigation relating to systems for temporary wafer bonding, brought by EVG against 3M in the US District Court for the Southern District of New York. Under the terms of the mostly confidential settlement, 3M, its customers, and licensed suppliers of its wafer support system will continue to make and sell the system in global semiconductor and packaging markets.





LATEST NEWS

• Photonics’ “Semiconductorization” Stands Out Among Trends at Photonics West 2025
  Feb 13, 2025
• ANELLO Adds Advisor for Defense Applications: People in the News: 2/12/25
  Feb 12, 2025
• Robust, Low-Cost Laparoscope Could Improve Surgical Outcomes Worldwide
  Feb 12, 2025
• Relativity Networks Raises $4.6M to Scale Next-Gen Optical Fiber Tech
  Feb 11, 2025
• With Transformation Plan in Effect, NUBURU Makes Further Changes to Leadership
  Feb 11, 2025
• Plastic Optical Fibers Enable Temperature Sensing with High Resolution
  Feb 11, 2025
• Single-Photon (and Long Range) Lidar Provides Eye-Safe, High-Resolution 3D Imaging
  Feb 10, 2025
• Salience Labs Closes $30M Funding Round
  Feb 10, 2025