Indium’s Andy Mackie Joins Editorial Board

Indium Corp. announced that its semiconductor assembly materials product manager, Dr. Andy C. Mackie, has joined the editorial board of Chip Scale Review, a magazine covering the chip-scale, flip chip, and wafer-level packaging market. Mackie has over 19 years of experience in new product development, sales, and marketing for electronics assembly and semiconductor packaging. He is an industry expert in solder paste printing, reflow, and atmosphere control in electronics assembly. In 2001, he received the IPC President's Award for his leadership in IPC's solder paste task group and the assembly and joining materials subcommittee. Mackie has a PhD in physical chemistry from the University of Nottingham, UK, and a master of science degree in surface and colloid chemistry from the University of Bristol, UK. He is trained in Six Sigma "Design of Experiments" and has written numerous published papers. Indium, based in Clinton, N.Y., is a materials supplier to the electronics assembly, semiconductor fabrication and packaging, solar photovoltaic, and thermal management markets.