Infotonics Center Employs Suss MicroTec Tools

The Infotonics Technology Center of Canandaigua, N.Y., has selected Suss MicroTec America Inc.’s bonding systems for use in its microelectromechanical systems (MEMS) packaging laboratory to provide R&D and pilot production capabilities. The ABC200 modular wafer bonding cluster tool will allow automated precision alignment, cleaning and bonding in one system, and, for flip chip processes, the FC150 device bonder provides configurations from manual to full automation. The Suss MicroTec Wafer Bonder Div. is based in Waterbury Center, Vt. Infotonics focuses on the design, simulation, packaging, testing and metrology of MEMS and micro-optoelectromechanical systems.