Suss Bonding System Chosen for Infotonics' MEMS Center

Microelectromechanical systems (MEMS) wafer-bonding solutions provider Suss MicroTec of Munich, Germany, announced today that Infotonics has selected the company's ABC200 wafer-bonding cluster tool and FC150 device bonder for its MEMS packaging lab. "The ABC200 will allow automated precision alignment, cleaning, bonding and inspection all in one system. The ABC200 cluster tool modularity allows us to run a variety of bonding processes for both R&D and pilot production," said Nancy Stoffel of the Infotonics Technology Center. The FC150 provides development and pilot production capabilities for flip chip processes. The Infotonics Technology Center was formed in 2001 by Eastman Kodak Co., Corning Inc. and Xerox Corp. as a nonprofit corporation to operate New York State's Center of Excellence in Photonics and Microsystems. It is located in Canandaigua, N.Y., and provides R&D on photonics, MEMS and MOEMS (micro-optoelectromechanical systems) to the biomedical and communications industries.