Passive alignment:

Yasuhiro Suzuki, NTT Optoelectronics Laboratories

The cost issues of conventional optical module technologies arise from the long assembly time, the large number of components, and the need for costly hermetically-sealed packages. To overcome the above shortcomings, the industry needs innovative packages, assembly processes and device structures. In response, researchers have developed hybrid integration technologies, including passive alignment, lens-less optical coupling, and non-hermetically-sealed packages.