The companies said the agreement underscores their commitment to developing flexible new "hybrid" chips that combine the best attributes of standard ASIC and flexible FPGA technology for use in communications, storage and consumer applications.
"Savings here could be dramatic," said Michel Mayer, general manager, IBM Microelectronics Div. "When an ASIC takes on more function, you can reduce cost by eliminating one, two or even more separate chips. With this technology, customers would be able to tweak designs and integrate new changes immediately, eliminating the need to restart a whole new design cycle, bringing tremendous time-to-market advantages."