GSI Lumonics Delivers Chip-Scale Package Marking System

KANATA, Ontario, June 17 -- GSI Lumonics Inc. said it has delivered its new CSP300 wafer marking system to a semiconductor producer for use in the industry's first production application in marking CSPs on 300 mm wafers.

The company said marking CSPs is critical for both traceability and product identification. The use of CSPs -- which are small, packageless IC devices -- in next-generation end-user products such as smart phones and advanced PDAs is expected to grow rapidly as functionality increases and product form factors shrink.

"GSI Lumonics pioneered wafer marking processes over 20 years ago and is the recognized industry leader for wafer marking applications," said Charles D. Winston, president and CEO of GSI Lumonics.