The company's aggressive IP growth is driven by market demand for low cost packaging and assembly for existing and future fiber optic components that are used to build and implement optical networks for telecom and datacom. The technologies covered by the patent applications include: optical subassembly, materials processing, micromachining for automated assembly, 1-D and 2-D fiber/lens arrays, sensors and actuators, silicon optical bench (SiOB), lenses, interconnects, automation, packaging technologies, and methods and tools, among others. The patents are aimed at creating cost reductions and yield improvements through materials technology and processes for current and next generation fiber optic devices.