The Shellcase MVP wafer-level chip-scale packaging solution is available from Tessera Technologies Inc. The solution targets OEMs and camera-module manufacturers seeking to build thinner mobile devices. It enables low-profile camera modules while reducing assembly yield loss from contamination. The technology complies with JEDEC Level 1 moisture sensitivity requirements, which makes it suitable for applications in the automotive industry. The technology supports 3-D die-stacking of the image sensors with other devices, such as digital signal processors and flash memory.

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