View Company Profile for Advanced Applied Adhesives

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Advanced Applied Adhesives offers electrically insulating die-attach adhesives with a low coefficient of thermal expansion to reduce strain. The AAA2300, –2301 and –2303 low-bleed adhesives are suitable for pyramidal-die-stack on bleed-prone nitride passivated die with no polyimide final passivation. The ultrafine silica filler is designed for a 1-mil or thinner bond line and does not damage the bottom die. The adhesives are used in same-die-stack applications that require a gap filling bond line in place of a dummy die. The materials fill the gap to the die edge to support the top die for wire bonding, and they protect bonding wires from breaking in temperature cycling and from thermal shock.

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