BERGISCH GLADBACH, Germany, July 16, 2012 — Fries Research & Technology GmbH has updated its MicroSpy Topo DT. The new generation of the surface measuring device combines two measuring technologies in a new and more compact design: a confocal microscope and a white-light interferometer.
The instrument can characterize flat and structured test pieces that are either weakly or highly reflective, on a noncontact and nondestructive basis within a few seconds. The optical measuring device images roughness, contour and 3-D topography with micro- and nanometer resolution.
The new generation of the MicroSpy Topo DT has a wide adjustment range of 50 mm in height and 100 × 100 mm in area. Its rotating turret makes it possible to rapidly switch between different lenses with different magnifications.
The turret can be equipped with up to six lenses at the same time, enabling flexible deployment of the measuring device. Structures in the subnanometer range can be characterized with high lateral resolution.
Flat test piece surfaces such as lenses, glass and wafers can be measured in white-light-interferometer mode, and more markedly structured surfaces can be analyzed in confocal mode. The included image analysis software enables analysis of the measurement results with regard to geometry, roughness and evenness.
The stitching function enables precise measurement of large test pieces.
In the standard configuration, the multipurpose device for laboratory and production is supplied with two lenses, a tilting table and active vibration damping.
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