BERLIN, June 18, 2012 — VI Systems has launched a line of high-speed vertical-cavity surface-emitting laser (VCSEL) chips that operate at data rates of up to 40 Gb/s. The new generation of 850-nm VCSEL dice and VCSEL arrays (1 × 4 and 1 × 12) feature an ultrahigh −3-dB modulation bandwidth of 20 GHz and a HAB contact pad design that overcomes the problems of thick and soft planarization layers and enables ultrarobust bonding and packaging.
The company’s manufacturing approach and array designs are in compliance with the standard 250-µm device-to-device pitch (linear spacing), allowing systems developers to extend their capabilities in energy-efficient data communication.
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