A two-component epoxy adhesive/sealant for cryogenic applications has been released by
Master Bond Inc. The EP29LPSP compound withstands temperatures as low as 4 K and resists cryogenic shocks, such as a drop from room temperature to liquid helium temperatures in a 5- to 10-min period. The optically clear substance has a mix ratio of 100:65 by weight. Although it cures at room temperature, optimal results are achieved if it is heat-cured at 130 to 165 °F. It bonds well to a variety of substances, including metals, glass, ceramics and plastics. When curing, it has a low exotherm. Its mixed viscosity is 400 cps. It has a tensile strength of 6500 psi and a tensile modulus of >375,000 psi.
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